Posts Tagged ‘bga ram upgrade solder’
HTC Universal memory upgrade – 128MB
With the help of Mamaich and some others (please add all i have forgotten), the Universal can now have 128 MB of Ram instead of 64 MB. This procedure involves hardware modification! Do it at your own risk! These are the steps that are needed to accomplish the ultimative goal of having 128 MB Ram:
This is an update to the previous information that was here but a little out of date. This procedure is how to upgrade your Universal from 64Mb to 128Mb by removing the two 32Mb M-RAM chips and replacing them with two 64Mb M-RAM chips. This is a complex procedure and requires some specialist equipment to do the job. You will need the following equipment to do the job properly.
- Hot air re-work station with vacuum pick-up
- Soldering iron
- Solder wick
- BGA re-work station
- X-Ray equipment
- Magnified inspection equipment
- Flux
First thing is to get hold of two of the 64Mb M-RAM chips.
What you need are Infineon HYB25L512160AC -7.5 (2 pcs – 512MBit each)
Chips harvested from the BlueAngel are confirmed to work.
These chips are 54-ball BGA’s (Ball Grid Array) devices, which means that they have little solder balls (0.4 mm) on the bottom and cannot be soldered using a conventional soldering iron. It is also worth mentioning that these chips are moisture sensitive and must be stored in dry conditions preferable in dry-pack sealed packaging. If they get damp there is a chance that they will “Pop-corn” during the soldering process. i.e. the moisture will turn to steam and split open the chips.
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