TechOnline has a report about exactly what makes it tick and they’ve managed to identify all the important chips on the iPhone’s mainboard to get some insight into Apple’s design choices.

They note that the 3G iPhone is an incremental improvement over the original iPhone rather than a ground up redesign. Of particular interest is how many of the new wireless parts are from Infineon, while the main processor remains a Samsung part. Strangely, given Apple’s huge flash order with Samsung, the memory itself seems to be from Toshiba. Check out the original article for a fuller description of the new iPhone’s silicon underpinnings. There are also some videos of the teardown.

Original source